TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning
arXiv:2602.11187v1 Announce Type: new Abstract: The rapid growth of electronics has accelerated the adoption of 2.5D integrated circuits, where effective automated chiplet placement is essential as systems scale to larger and more heterogeneous chiplet assemblies. Existing placement methods typically focus on minimizing wirelength or transforming multi-objective optimization into a single objective through weighted sum, which limits their ability to handle competing design requirements. Wirelength reduction and thermal management are inherently conflicting objectives, making prior approaches inadequate for practical […]